Wafer level chip scale packaging

Wafer to tape

  • Electrical test
  • Wafer inspection before pick
  • Side wall inspection
  • Active side inspection
  • Mark side inspection

Standard Process

Wafer to tape and reel machine for Wafer Level Chip Scale Packaging (WLCSP)
  • Up to 12 inch wafers
  • Die size down to 0.3X0.5 mm
  • Ultra thin components to 0.05 mm thick
  • Ultra accurate direct linear servo motors
  • Vision position correction


100% automated final inspection tape to tape machine.
  • 30 years experience
  • Mature process oriented around FMEA
  • Statistical process control
  • Integrated 6S inspection and electrical test available
  • 100% automated final vision inspection