Backend Wafer Processing

BACKEND Wafer Processing

One stop shop for wafeR LEVEL SHIP SCALE PACKAGING (WLCSP)

standard process

Incoming Inspection
Laser Mark
Mark Inspection
Wafer Mount
Wafer Dice
Wafer Clean
Dice Inspection

Laser Mark

Wafer laser marking component traceability

Marking of backside wafers facilitates traceability of semiconductor devices
Marks of negligible influence on the devices
Marking accuracy of 10 um
Up to 12" in size

Wafer dicing

Wafer dicing equipment to support back end wafer processing.

On-line blade load monitoring system ensures high quality cut
Intelligent blade wear learning automatically compensates for blade wear
Close loop control for ultimate cut quality
Robust platform supports the most demanding application
Vision kerf statistical process control