Pelican Packaging,Inc.
5816 Dryden Place
Suite 103
Carlsbad, CA 92008
USA

(760) 438-6100
(760) 438-6101 Fax

© 2000-2010
All rights reserved

Wafer Processing:



Incoming Inspection

Wafer Marking

Wafer Mounting

Wafer Dicing

Wafer Cleaning





Wafer Marking:

• Marking of backside silicon wafers facilitates traceabilities of semi-conductor devices

• Marking is miniaturized and have no negative influence on the devices

• Chip miniaturization marking is possible with accuracy at 50um


Wafer Dicing:

• On-line blade load monitoring system ensures high quality cut

• An intelligent blade wear curve learning system automatically compensates for blade wear

• Close loop control for ultimate cut quality

• Robust platform supports the most demanding applications


(click photos for larger image)












Capacity of 600 million components per year


Complete ESD protection

Vision and Test capability available
Ink Dot Detection
Surface Inspection
2-D Ball Inspection