Pelican Packaging,Inc.
1806 Ord Way
Oceanside, Ca 92056
USA

(760) 438-6100
(760) 438-6101 Fax

© 2000-2011
All rights reserved

Wafer Processing:



Incoming Inspection

Wafer Marking

Wafer Mounting

Wafer Dicing

Wafer Cleaning





Wafer Marking:

• Marking of backside silicon wafers facilitates traceabilities of semi-conductor devices

• Marking is miniaturized and have no negative influence on the devices

• Chip miniaturization marking is possible with accuracy at 50um


Wafer Dicing:

• On-line blade load monitoring system ensures high quality cut

• An intelligent blade wear curve learning system automatically compensates for blade wear

• Close loop control for ultimate cut quality

• Robust platform supports the most demanding applications


(click photos for larger image)










We have moved. Our new address is:
1806 Ord Way
Oceanside, Ca 92056

Capacity of 2 billion components per year


Complete ESD protection

Vision and Test capability available
Ink Dot Detection
Surface Inspection
2-D Ball Inspection