Pelican Packaging,Inc.
5816 Dryden Place
Suite 103
Carlsbad, CA 92008
USA
(760) 438-6100
(760) 438-6101 Fax
© 2000-2010
All rights reserved
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Electrical Test:
Wafer-Test-Tape:
Dicing, handling, picking, and flipping and other packaging operations can alter the IC performance. Therefore, it is necessary to test each individual IC again just before the tape and reel process. The test interface will consist of a test socket or contactor, an interface
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board, and a frame, also referred to as a test head adapter. Our ability to process a final test as a last operation before tape and reel is what sets us apart from other companies which only process test at the wafer level.
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Tape-Test-Tape:
Nobody likes to trash parts due to potential bad components in tape. Our ability to retest from tape to tape allows you to guarantee 100% good parts in tape.
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Capacity of 600 million components per year
Complete ESD protection
Vision and Test capability available |
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Ink
Dot Detection
Surface Inspection
2-D Ball Inspection
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