Pelican Packaging,Inc. 1806 Ord Way Oceanside, Ca 92056
USA
(760) 438-6100
(760) 438-6101 Fax
© 2000-2011
All rights reserved
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Die
Processing:
PROCESS:
Vision:
•
Ink Dot Detection
• Surface Inspection
• 2-D Ball Inspection
Electrical Test
Packaging:
•
Tape
• Waffle Pack (2" x 2" or 4"
x 4")
• Gel-Pak
• Wafer Rebuild (up to 300mm)
Final Visual Inspection |
Components:
• CSP
• Bar Die
• QFN
•
MLF
Wafers Size:
Up to 12 Inch
Die Size:
0.5 x 0.5mm to 25.4 x 25.4mm
(click
photos for larger image)
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We have moved. Our new address is: 1806 Ord Way Oceanside, Ca 92056
Capacity of 2 billion components per year
Complete ESD protection
Vision and Test capability available |
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Ink
Dot Detection
Surface Inspection
2-D Ball Inspection
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