Pelican Packaging,Inc.
5816 Dryden Place
Suite 103
Carlsbad, CA 92008
USA

(760) 438-6100
(760) 438-6101 Fax

© 2000-2010
All rights reserved

Die Processing:


PROCESS:

Vision:


• Ink Dot Detection
• Surface Inspection
• 2-D Ball Inspection

Electrical Test

Packaging:

• Tape
Embossed Tape
Paper Tape
Surf Tape
Sticky Tape

• Waffle Pack (2" x 2" or 4" x 4")

• Gel-Pak

• Wafer Rebuild (up to 300mm)

Final Visual Inspection


Components:

• CSP
• Bar Die
• QFN
• MLF

Wafers Size:
Up to 12 Inch

Die Size:
0.5 x 0.5mm to 25.4 x 25.4mm


(click photos for larger image)





Capacity of 600 million components per year



Complete ESD protection



Vision and Test capability available
Ink Dot Detection
Surface Inspection
2-D Ball Inspection